Loading...
HomeMy WebLinkAbout4.A.1. Approval of distribution of Opus EAW for Comment �,�� Consent Business 4. A. 1. Sl i;'1KC)Pf-}: TO: Mayor and City Council Mark McNeill, City Administrator FROM: R. Michael Leek, Community Development Director DATE: 08/07/2013 SUBJECT: Approval of distribution of Opus EAW for comment (B) Action Sought City Council is asked to offer and pass a motion authorizing distribution and posting of the draft EAW for Opus' development of property located on Valley Park Drive and adjacent to the proposed Emerson project. Background City Council approved the plat of Valley Park Business Center First Addition. The eastern portion of that plat contains the former ADC/prospective Emerson building. The property to the west was designated as an outlot. Opus proposes the development of this property for industrial and office uses. The amount of square footage that can be developed on the site exceeds the threshold for a mandatory Environmental Assessment Worksheet (EAW). Opus has present plans to develop a first "spec" building on the site. With the assistance of the Ciry's engineering consultant a draft EAW utilizing two development scenarios has been prepared. Council is asked to authorize posting and distributing the EAW for comment. Recommendation Staff recommends that the City Council offer and pass a motion authorizing distribution for comment and posting of the draft EAW for Opus' development of property identified currently as Outlot 1, Valley Park Business Center First Addition. Budget Impact There is no budget impact as the applicant for EAW review (Opus) has agreed to pay the costs of preparation and distribution of the EAW. Relationship to Vision This item relates to City Goal B. Positively manage the challenges and opportunities presented by growth development and change. Requested Action Offer and pass a motion authorizing distribution for comment and posting of the draft EAW for Opus' development of property identified currently as Outlot 1, Valley Park Business Center First Addition. Attachments: